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Chip Quik AD7 Thermoset Chip Bonding Epoxy is designed to bond surface-mount chips and ICs to printed circuit boards (PCBs). The AD7 epoxy has low viscosity and is designed to be dot/line dispensed, allowing large and heavy surface-mount components to be permanently bonded to a PCB during reflow. This application enables two-sided mount reflow without larger chips or ICs coming loose. Curing time ranges from 120 to 180 seconds at the recommended curing temperature range of +190°C to +260°C. The maximum recommended dot size for Chip Quik AD7 Epoxy is 10mm x 10mm x 1mm.
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Chip Quik AD7 Thermoset Chip Bonding EpoxyDesigned to bond surface-mount chips and ICs to printed circuit boards (PCBs).30/8/2567
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Chip Quik Dispensing NeedlesDesigned for dot dispensing and line dispensing of flux, solder paste, and other fluids.14/5/2567 -
Metcal Solder Bench ApplicationsNumerous products enhance engineers' solder benches, making the workspace more efficient.12/9/2566 -
Chip Quik Manual Syringe GunDesigned for 5cc syringes and offers excellent dispensing control.3/8/2566